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march 2007 rev 2 1/11 STPS30H60C power schottky rectifier main product characteristics features and benefits high junction temperature capability avalanche rated low leakage current good trade-off between leakage current and forward voltage drop high frequency operation description dual centre tab schottky rectifier suited for high frequency switch mode power supply. packaged in to-220fpab, to-220ab, to-247, i 2 pak, and d 2 pak, this device is intended to be used in notebook and lcd adaptors and desktop smps. in these applications the STPS30H60C provides a good margin between the remaining voltages applied on the diode and the voltage capability of the diode order codes i f(av) 2 x 15 a v rrm 60 v t j 175 c v f (typ) 0.535 v part number marking STPS30H60Ct STPS30H60Ct STPS30H60Cr STPS30H60Cr STPS30H60Cg-tr STPS30H60Cg STPS30H60Cg STPS30H60Cg STPS30H60Cw STPS30H60Cw STPS30H60Cfp STPS30H60Cfp a1 a2 k to-247 STPS30H60Cw d 2 pak STPS30H60Cg to-220ab STPS30H60Ct i 2 pa k STPS30H60Cr to-220fpab STPS30H60Cfp a1 k a2 a1 k a2 a1 k a2 a1 k a2 a1 k a2 www.st.com
characteristics STPS30H60C 2/11 1 characteristics to evaluate the conduction losses use the following equation: p = 0.45 x i f(av) + 0.008 x i f 2 (rms) table 1. absolute ratings (limiting values per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) rms forward current 30 a i f(av) average forward current, = 0.5 to-220ab t c = 155 c per diode 15 a total package 30 to-220fpab t c = 135 c per diode 15 total package 30 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 230 a p arm releative peak avalanche power t j = 25 c t p = 1 s 10 200 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 175 c 1. condition to avoid thermal runaway for a diode on its own heatsink dp tot dt j --------------- 1 r th j a ? () ------------------------ - < table 2. thermal parameters symbol parameter value unit r th(j-c) junction to case to-220ab, i 2 pak, d 2 pak, to-247 per diode 1.5 c/w to t a l 0 . 8 to-220fpab per diode 4.7 total 3.95 r th(c) coupling to-220ab, i 2 pak, d 2 pak, to-247 0.1 to-220fpab 3.2 table 3. static electrical characteristics symbol parameter test conditions min. typ max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 60 a t j = 125 c 8 25 ma v f (2) forward voltage drop t j = 25 c i f = 7.5 a 550 mv t j = 125 c 435 470 t j = 25 c i f = 15 a 660 t j = 125 c 535 570 t j = 25 c i f = 30 a 820 t j = 125 c 635 690 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
STPS30H60C characteristics 3/11 figure 1. conduction losses versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5, per diode) p (w) f(av) 0 2 4 6 8 10 12 0 2 4 6 8 10 12 14 16 18 =0.05 =0.1 =0.2 =0.5 =1 t =tp/t tp i (a) f(av) i (a) f(av) 0 2 4 6 8 10 12 14 16 18 0 25 50 75 100 125 150 175 r h(j a) =r th(j c) r th(j a) =15 c/w to-220fpab t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 1.e-03 1.e-02 1.e-01 1.e+00 1.e+00 1.e-01 1.e-02 1.e+01 1.e+02 1.e+03 t (s) p p(t) p (1s) arm p arm 0.0 0.2 0.4 0.6 0.8 1.0 1.2 25 50 75 100 125 150 t (c) j p(t) p (25c) arm p arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values, per diode) (to-220ab, to-247 d 2 pa k , i 2 pa k ) figure 6. non repetitive surge peak forward current versus overload duration (maximum values, per diode) (to-220fpab) i (a) m 0 20 40 60 80 100 120 140 160 180 200 1.e-03 1.e-02 1.e-01 1.e+00 t c =50c t c =75c t c =125c i m t =0 5 t(s) 0 20 40 60 80 100 120 1.e-03 1.e-02 1.e-01 1.e+00 t c =50 c t c =75 c t c =125 c i m t =0 5 to-220fpab i (a) m t(s)
characteristics STPS30H60C 4/11 figure 7. relative variation of thermal impedance junction to case versus pulse duration (to-220ab, to-247 d 2 pak, i 2 pak) figure 8. relative variation of thermal impedance junction to case versus pulse duration (to-220fpab) z/r th(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 =0.1 =0.2 =0.5 single pulse t =tp/t tp t (s) p 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 =0.1 =0.2 =0.5 single pulse t =tp/t tp to-220fpab t (s) p z/r th(j-c) th(j-c) figure 9. reverse leakage current versus reverse voltage applied (typical values, per diode) figure 10. junction capacitance versus reverse voltage applied (typical values, per diode) i (ma) r 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 45 50 55 60 t j =125c t j =100c t j =75c t j =50c t j =25c t j =150c v (v) r c(nf) 0.1 1.0 10.0 1 10 100 f=1mhz v osc =30mv rms t j =25c v (v) r figure 11. forward voltage drop versus forward current (per diode) figure 12. thermal resistance junction to ambient versus copper surface under tab (epoxy printed board fr4, copper thickness = 35 m) (d 2 pa k ) i (a) fm 1 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 t j =25 c maximum values t j =125 c maximum values t j =125 c maximum values t j =125 c typical values t j =125 c typical values v (v) fm 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 s(cm2) r (c/w) th(j-a)
STPS30H60C package mechanical data 5/11 2 package mechanical data epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.8 nm maximum torque value: 1.0 nm table 4. to-220fpab dimensions ref. dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 f2 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f2 f d e l4 g1 g l2 l3
package mechanical data STPS30H60C 6/11 table 5. to-220ab dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m
STPS30H60C package mechanical data 7/11 table 6. to-247 dimensions ref dimensions millimeters inches min. typ. max. min. typ. max. a 4.85 5.15 0.191 0.203 d 2.20 2.60 0.086 0.102 e 0.40 0.80 0.015 0.031 f 1.00 1.40 0.039 0.055 f1 3.00 0.118 f2 2.00 0.078 f3 2.00 2.40 0.078 0.094 f4 3.00 3.40 0.118 0.133 g 10.90 0.429 h 15.45 15.75 0.608 0.620 l 19.85 20.15 0.781 0.793 l1 3.70 4.30 0.145 0.169 l2 18.50 0.728 l3 14.20 14.80 0.559 0.582 l4 34.60 1.362 l5 5.50 0.216 m 2.00 3.00 0.078 0.118 v5 5 v2 60 60 dia. 3.55 3.65 0.139 0.143 h l2 l5 l l4 d e m l1 l3 f2 f3 f4 f1 v2 f(x3) g a v v dia
package mechanical data STPS30H60C 8/11 table 7. i 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 e 10 10.40 0.394 0.409 l 13 14 0.512 0.551 l1 3.50 3.93 0.138 0.155 l2 1.27 1.40 0.050 0.055 e l2 l1 b1 d a1 c c2 a b e e1 l
STPS30H60C package mechanical data 9/11 figure 13. footprint (dimensions in millimeters) in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect . the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 8. d 2 pak dimensions ref. dimensions millimeters inches min. max min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2m m a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
ordering information STPS30H60C 10/11 3 ordering information 4 revision history part number marking package weight base qty delivery mode STPS30H60Ct STPS30H60Ct to-220ab 2.23 g 50 tube STPS30H60Cr STPS30H60Cr i 2 pak 1.49 g 50 tube STPS30H60Cg STPS30H60Cg d 2 pak 1.48 g 50 tube STPS30H60Cg-tr STPS30H60Cg-tr d 2 pak 1.48 g 1000 tape & reel STPS30H60Cw stps30h60w to-247 4.46 g 30 tube STPS30H60Cfp STPS30H60Cfp to-220fpab 2.00 g 50 tube date revision description of changes 27-feb-2006 1 first issue 31-mar-2007 2 added to-220fpab package. updated thermal parameters in table 2.
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